Al/SiCP electronic packaging materials embedded metal components were fabricated by gas pressure infiltration.
采用气压浸渗技术完成了Al/SiCP电子封装材料嵌入金属元件的制备,应用能谱分析、XRD观察了界面层微观组织,并对界面连接强度进行了抗弯强度性能测试。
Production technology of ZrW_2O_8/Al6013 composites prepared by moulding pressure infiltration method was introduced and the microstructure and coefficients of thermal expansion of ZrW_2O_8/Al6013 composites were studied.
介绍了模压浸渗复合法制备ZrW2O8/A l6013复合材料的工艺过程,并对该复合材料的组织和热膨胀性能进行了初步探讨。
The superplastic characteristics of the betaSiC whisker reinforced LY12 aluminum composite, fabricated by pressure infiltration and hotrolling after extrusion with a low extrusion ratio, were investigated The results show that the SiCw/LY12 composite exhibit a total elongation of 200%370% in the initial strain rate region from 33103 to 33102 s1at 788808
对压力浸渗、小挤压比挤压以及进一步轧制制备的β－ＳｉＣ晶须增强ＬＹ１２铝基复合材料的超塑性变形行为进行了研究。
The scientific and technical matters concerned with the stability and the rheology properties of SiC slips, the packing behaviors of SiC powders, the manufacture of SiC tape and bulk skeletons, and the process of pressure infiltration were investigated.
研究了ＳｉＣ料浆的稳定性和流变特性、ＳｉＣ粉末的填实过程、ＳｉＣ薄带和骨架的制备技术、ＳｉＣ的固相烧结和骨架密度的控制，以及压力浸渗等科学问题和工艺问题。
The article discussed the effect of preparing particle reinforced metal matrix composites by the path of pressure infiltration and the way of "nonuniform reinforced" to reduce the critical osmotic pressure and deformation degree of prefabricated body; and the possibility of improve plasticity and toughness of complex material to certain degree was also discussed.
本文通过“非均匀增强”的方式，探讨了用压力浸渗法制备颗粒增强金属基复合材料的途径，对减小临界浸渗压力及降低预制体变形程度的效果，以及在一定程度上改善复合材料塑性和韧性的可能性。
Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;
气压浸渗SiCp/Al电子封装外壳的制备与性能
Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;
气压浸渗法制备Al/SiCp电子封装材料的研究
oil immersed forced air cooled transformer
油浸强制气冷变压器
The FEM Simulation and Pressure Infiltration of Al_2O_3p/ZL104 Composites;
压力浸渗制备Al_2O_3p/ZL104复合材料及有限元模拟
The FEM Simulation of the Liquid Infiltration-Extrusion Process Including Damage for Composites;
复合材料液态浸渗挤压有限元模拟及损伤研究
The FEM Simulation of the Liquid Infiltration-Extrusion Process for Composites;
复合材料液态浸渗挤压过程的有限元模拟
Research on the FEM Simulation of the Liquid Infiltration-Extrusion Process for Fabricating MMC;
液态浸渗挤压复合材料过程的有限元模拟
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
Study of Flue Gas Desulfurization by Contained Liquid Membrane
液膜法烟气脱硫试验 Ⅰ.含浸液膜渗透器特性
SO2 separation from flue gas in a hollow fiber contained liquid membrane permeator
中空纤维含浸液膜渗透器烟气脱硫的研究
The interfacial reactions enhance the wettability and promote the spontaneous infiltration process.
界面反应的存在提高了润湿性,促进了无压自发浸渗。
A Study on the Bending Strength and Wear Resistance of SiC/Al Composites by Pressureless Infiltration;
无压浸渗法制备SiC/Al复合材料强度和耐磨性的研究
Preparation and Thermal Expansion Propertise of SiC_P/Al Composites by Vacuum Pressure Infiltration Precess;
真空压力浸渗法制备SiC_P/Al复合材料及热膨胀性能研究
Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;
无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究
Study on Process and Thermal Properties of Si_P/Al Composites Prepared by Pressureless Infiltration;
高含量Si_P/Al热控制材料的无压浸渗工艺及热性能研究
Effect of the Reactive Additions on the SiCp/Al Composites Fabricated by the Pressureless Infiltration Technique;
活性剂对无压自浸渗法制备SiCp/Al复合材料的影响
Fabrication and Properties of β-SiCp/Al Electronic Packaging Material by Pressureless Infiltration;
无压浸渗法制备β-SiCp/Al电子封装材料工艺与性能研究
Study on Technology and Properties of Al_2O_(3f)/AZ91D Composite Prepared by Pressrueless Infiltration Method;
无压浸渗法制备Al_2O_（3f）/AZ91D复合材料工艺及性能研究