Advances in experimental study and production practice of cyanide-free copper plating—Part I
无氰镀铜的实验研究与生产应用进展(一)
Research and application of cyanide-free copper plating has made a certain progress and obtained effective achievements,but it still exists problem of low adhesion as plating on iron and steel substrates.
无氰镀铜的研究应用已取得一定的进展和成效,但在钢铁基体上镀铜仍存在结合力差的问题。
Recovery of Copper from Copper-electroplating waste Liquor by Magnetic field fluidized Bed;
用磁场流化床从镀铜废液中回收铜
Cyanide-free copper electroplating in sulfite/thiosulfate bath
亚硫酸盐/硫代硫酸盐体系无氰镀铜
Advances in experimental study and production practice of cyanide-free copper plating--Part Ⅱ
无氰镀铜的实验研究与生产应用进展(二)
Advances in experimental study and production practice of cyanide-free copper plating-Part I
无氰镀铜的实验研究与生产应用进展(一)
Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;
无氰电镀22K金—铜合金工艺研究
Investigation on Cyanide-free Alkaline Copper Electroplating and Eletrochemical Behavior
无氰碱性镀铜工艺及其电化学过程的研究
Process for Cyanide-Free Copper Electroplating of Aluminum Alloy and Its Application on Automobile Wheels Made of Aluminum Alloy
无氰高密度镀铜工艺及其在汽车轮毂中的应用
Zinc base die castings are always copper plated in cyanide baths.
锌基合金的压铸件总是在氰化镀液中镀铜。
Safeguard of Solution and influence of Impurities for Non- Cyaniding Silver Electroplating
无氰镀银溶液的维护及杂质对镀层质量的影响
Investigation on Anticarbonized Bright Copper-plating Process in Basic Cyanide Baths
碱性氰化物防渗碳光亮镀铜工艺的研究
Study on Additives in Gold electroplating for a Cyanide-free Bath
一种新型无氰镀金配体及添加剂研究
Study on Cyanide-free Eletroless Nickel Plating Process on AZ91D Magnesium Alloy
AZ91D镁合金无氰浸锌化学镀镍的研究
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
To coat or finish with a layer of copper.
镀铜于给…包铜或镀铜
Experiment on Cu-Bi Cyanide-free Flotation for Cu-Bi Multi-metal Ores in Jiangxi Province
江西某铜铋多金属矿石无氰铜铋分离浮选试验
Microstructure and Properties of Cyanide-Fret Pulse-Plated Galvanizing Coating on AZ31B Magnesium Alloy
AZ31B镁合金无氰脉冲镀锌层的结构与性能
Effect on the release of the Ni ion for the nickel-chromium alloy with non-cyanide gold-plated layer treatment
无氰镀金对镍铬合金Ni离子析出的影响
Influences of K4Fe(CN)_6 on Electroless Copper Plating Using Hypophosphite as Reducing Agent
亚铁氰化钾对以次磷酸钠为还原剂化学镀铜的影响
Research of Chemical Cu-plating on the CNF Absent of Palladium
无钯催化纳米炭纤维化学镀铜的研究