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tin-antimony-silver-nickel solder for hermetical sealing

基本解释锡锑银镍封装焊料

网络释义

1)tin-antimony-silver-nickel solder for hermetical sealing,锡锑银镍封装焊料2)silver-tin solder,银锡焊料3)tin-silver solder,锡银焊料4)antimonial tin solder,锑锡焊条5)SAC Alloy,锡银铜无铅焊料6)copper solder,铜基锡银焊料

用法和例句

Determination of trace lead in silver-tin solder with flame atomic absorption spectrum;

火焰原子吸收光谱法测定银锡焊料中的微量铅

A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.

提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法。

Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES

同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银

tin-lead 60-40 solder

锡铅60-40焊料

Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.

无铅焊锡—锡铋锌系无铅焊锡,材料设计、开发,焊料(锡球、锡膏)开发等。

Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.

无铅焊锡—锡铋锌系无铅焊锡,材料设计、发,焊料(球、膏)发等。

Casting tin-lead solders

GB/T8012-1987铸造锡铅焊料

Sterling aluminium solder

斯特林锡锌铝合金焊料

Tin-lead solders-Determination of silver content -Potentiometric titrimetric method

GB/T10574.9-1989锡铅焊料化学分析方法电位滴定法测定银量

Tin-lead solders-Determination of silver content-Flame atomic absorption spectrophotometric method

GB/T10574.8-1989锡铅焊料化学分析方法火焰原子吸收光谱法测定银量

Soldering materials are our major products, especially in Lead Free Soldering Materials.

焊锡物料是我们的主要产品,特别是无铅焊锡物料。

High precision welding materials pure tin lead alloy products.

高级精密焊接纯锡铅合金材料制品。

Tin-lead solder in the manufacture of professional audio equipment.

用于制造专业音响设备的铅锡焊料。

Constitutive Description of Tin-Lead Solder 63Sn-37Pb under Multiaxial Loading;

多轴加载下焊锡钎料63Sn-37Pb的本构描述

The Research on Brazing Process betweeen W-Cu Heat Sink with Plated Nickel and Silver-copper Solder

镀镍钨铜与银铜焊料钎焊工艺的研究

Electronic Hanliao; Electronic help of welding materials production; Research and development of new electronic materials; Tin welding materials; Electronic components; Electronic marketing tools.

电子焊料;电子助焊材料生产;新型电子材料研制开发;锡焊材料;电子元器件;电子工具销售。

Tin-lead solders-Determination of tin content-Potassium iodate titrimetric method

GB/T10574.1-1989锡铅焊料化学分析方法碘酸钾滴定法测定锡量

Inventory of special ICS having tin-lead solder on/in leads/balls, used in specialist/professional equipment.

用于专业设备,含有铅锡焊料的积体电路。

Sn-Pb soldering used in Ground-based Aeronautical Communication Equipment Manufacturing.

用于地基航空通讯设备制造业的铅锡焊料。

Transducers used in professional loudspeaker systems, using tin-lead solder.

用于专业扬声器系统,含有铅锡焊料的变换器。

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