capsulation
英[kæpsjʊ\'leɪʃən]
美[kæpsjʊ\'leɪʃən]
基本释义
- n.
- 封装
实用例句
To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景.
互联网
To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景.
互联网