bonder

To create new bonder business mode for new customer.

为新客户创建新的保税贸易模式.

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The X - Y table aquires the accuracy 5 μ m to ensure the exact positions of bonder spots.

X -Y工作台要求实现精度达5μm,以便保证各焊点的精确位置.

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There is some additional function, such as generating reports from summary of bonder data.

还有一些附加的功能比如统计机台的各项参数然后生成报表.

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Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法, 研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律.

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The automatic wire bonder is one of the primary equipments in semiconductor back - end production.

自动金丝球焊机是半导体制造后端工序的关键设备之一,图像识别系统是其核心技术.

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The device can replace the manual machine, and provide an equipment of varies die bonder.

该装置可取代手动装置, 为各种粘片机提供配套设备.

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This product design for IC assembly die bonding process on die bonder machine.

本产品是为IC封装自动贴片机及其贴片工艺而设计.

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The auto Die Bonder for SOT - 23 transistor is a high - speed , high - precision, machinery electronics integrated equipment.

SOT-23晶体管封装自动键合机是 高速 、 高精度机电一体化精密设备.

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This product design for IC assembly die attache process on die bonder machine.

本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计.

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Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

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