Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
多层印制板的制作是一个生产工序复杂且周期很长的过程,那么造成金属化孔镀层空洞的原因也就很复杂。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
sequentially-laminated mulitlayer
顺序层压多层印制板
Improvement of Multilayer Printed Board Quality by Relieving Residual Hot-pressing Stress
层压板热压释放残余应力对多层印制板品质的改善
" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"
GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
ALIVH multilayer printed Board
层间全内导通多层印制板
Test methods for voltage proof of surface layers on printed boards
GB/T7613.2-1987印制板表层耐电压试验方法
Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
Test method for insulation resistance within inner layers of multilayer printed boards
GB/T4677.17-1988多层印制板内层绝缘电阻测试方法
Test method for insulation resistance between layers of multilayer printed boards
GB/T4677.18-1988多层印制板层间绝缘电阻测试方法
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
interlayer contact
层间接触-印制电路板的
interlayer continuity
层间连接-印制电路板的
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
埋电阻台阶式多层微波印制板制造技术研究
Design and Manufacture of the Multi-Adapter Powder Press Equipment and the Hydraulic System
多层模板粉末压制设备及其液压系统的研制