In this research, a AI-method based on Neural Networks and Genetic Algorithms is used to determine the best process parameter in solder paste printing process.
本文采用基于神经网络与遗传算法的一种混合结构即神经网络—遗传算法,解决锡膏印刷制程中的参数优化的问题。
For the solder deviation defect of printed PCB is caused by the table s poor correction positioning precision, in this paper, the structure of the full automatic solder paste printer parallel table is analyzed at first.
针对平台纠偏定位精度不高而导致印刷后PCB锡膏偏移的问题,从全自动锡膏印刷机并联平台的结构分析出发,根据其运动特性,建立平台的运动分析模型,结合最小二乘法原理,给出了一种定位速度快、精度高的定位算法。
Research on precise alignment for full automatic solder paste printer
全自动视觉锡膏印刷机精密对准研究
Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing
内置无铅锡膏印刷机的检测算法研究
Applications of Fieldbus Control System for the Integrated Circuit Board Paste Printer
集成电路板锡膏印刷机现场总线系统应用
Research on structural optimization of the frame of high-accuracy solder paste printer
高精度锡膏印刷设备的机架结构优化研究
When the material is fully contained within the printing system, concerns about handling, drying out, moisture absorption or waste are eliminated.
当物料完全包括在锡膏印刷系统，关注处置，干燥，吸潮和减少浪费。
In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4).
在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
The Study Based on Characteristics of Stencil Opening Hole in the Solder Paste Deposition Process;
基于模板特性影响焊膏印刷落锡量过程控制研究
MThoe mProecnestsu Cmon-ttryolp oef Printer
Momentum型印刷机的焊膏印刷工艺控制
Application of SPC in Quality Control of Solder Paste Printing
SPC在焊膏印刷质量控制中的应用
Viscosity-A Key Factor for Quality Control in Solder Paste Printing
黏度——决定焊膏印刷质量的关键因素
an alloy of tin and lead and antimony used to make printing type.
含锡、铅和锑的合金，用于制印刷铅字。
The art, method, or business of printing.
印刷业印刷品，印刷方法或印刷业
To produce(a print or an impression) from type.
印刷通过印刷铅字制造（印刷品或印记）
microform reader-printer
缩微印刷品阅读印刷器
brushing printing
刷印（刷帚花版印花）
polychrome printing
套色印刷, 多彩印刷法
A print made from such a block.
印版印刷品用印版印出的印刷品
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。