Development and Prospect of SISC s Hybrid IC Technology;
二十四所混合集成电路技术发展历程与展望
An Analysis on Thermal Resistance of Assembly Structures for Hybrid IC s;
混合集成电路常见装配结构热阻分析
An Analysis on One-Way-Leaker Problems in Hybrid IC s;
混合集成电路“单向泄漏”问题分析
EMC Design of Hybrid Integrated Circuit;
混合集成电路的电磁兼容设计
Research trend of degraded mechanisms and control ways of gold and aluminum bonding in hybrid integrated circuit;
混合集成电路金铝键合退化与控制研究动态
The development of optoelectronic hybrid integrated circuits and systems both at home and abroad is summarized to coordinate the development of Chinas “Information Superhighway” and optical fiber communication networks.
研究了34~155Mb/s光发射驱动器、光接收前置放大器、光接收前放+主放、时钟提取与再生、扰码与解码等系列配套的长波长光电子混合集成电路与系统,并对上述各种光电子混合集成电路的结构、计算机模拟、测试结果及工艺流程作了介绍。
The application of hybrid integrated circuits in the large container inspect system;
混合集成电路在大型集装箱检查系统阵列探测器上的应用
Special HIC for military gyro;
军用陀螺专用混合集成电路
tape bonded hybrid
带焊接的混合集成电路
hybrid microassembly
混合集成电路微组装
large scale hybrid integrated circuit
大规模混合集成电路
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
The Implementation of One-dimension Wavelet Transform Through Hybrid of Analog and Digital Circuit;
数模混合集成电路实现一维小波变换
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
Application of Virtual Instruments Technique in HIC Testing;
虚拟仪器技术在厚膜混合集成电路测试中应用
Reliability investigation on microvave HIC technologies under critical transition temperature of superconductor
超导温度下微波混合集成电路工艺可靠性初探
Series and products of high frequency wideband amplifiers for hybrid integrated circuits used in cabled distribution systems
GB/T15295-1994电缆分配系统用混合集成电路高频宽带放大器系列和品种
A New Conductor System Replaced Au with Cu Used in Hybrid Microwave Integrated Circuits
用于微波混合集成电路的新型以铜代金导电系统
The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC
热成像技术在厚膜混合集成电路热设计中的应用
passive hybrid film integrated circuit
无源混合膜集成电路
This is called a hybrid integrated circuit .
这称为混合型集成电路。
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
The Design of Mixed Signals Power Management Integrated Circuit XDJ6398;
数模混合电源管理集成电路XDJ6398的设计
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16465-1996膜集成电路和混合膜集成电路分规范(采用能力批准程序)