Study of electroless Ni-P plating on the diamond;
金刚石表面化学镀Ni-P的研究
The low temperature bonding between 95%Al2O3 ceramics and 45 steel was realized through first electroless Ni-P plating on Al2O3ceramic blocks and then soldering them to steel blocks with a low melting point filler metal of 63Sn-34Pb-2Ag-1Bi alloy.
采用化学镀Ni-P膜法金属化Al2O3陶瓷,并用63Sn-34Pb-2Ag-1Bi钎料膏实现了95%Al2O3陶瓷与45钢之间的低温钎焊。
The reaction mechanisms of Ni-P electroless plating and Ni-P-SiC composite electroless plating are researched, and the reaction thermodynamics are analyzed.
本文论述了Ni-P化学镀和Ni-P-SiC复合化学镀的反应机理,并对化学镀反应的热力学和动力学进行了分析。
Ni-P electroless plating was adopted to encapsulate the as-received CaF2 in the preparation of precursor mixed powders of NiCr-Cr3C2-40%CaF2(wt.
%)复合合金粉末为原料,采用Nd:YAG激光熔覆技术,在γ-TiAl合金基体表面成功制备出了高温自润滑耐磨复合材料涂层,在复合粉体准备时,采用Ni-P化学镀包覆原始CaF2颗粒,以减少其在激光熔覆过程中的分解、蒸发和上浮。
In order to improve the deposition rate and anti-corrosion properties of electroless plating Ni-P on aluminum,effects of stabilizing agents and surface active agents on the deposition rate and corrosion resistance of electroless plating Ni-P were studied.
为了改善铝基体上化学镀Ni-P存在的镀速慢、镀层腐蚀性能差等问题,研究了稳定剂和表面活性剂对铝化学镀Ni-P镀层的沉积速度、硬度、孔隙率、结合力、耐蚀性、腐蚀电位、表面形貌等性能的影响。
In order to improve the corrosion resistance of ZL101A alloy, the electroless plating Ni-P coatings with and without electroplating Cu layer were investigated by potentiodynamic polarization, salt spary test, SEM, microhardness meter.
为提高ZL101A合金的耐蚀性能,可直接化学镀Ni-P或电镀Cu后化学镀Ni-P在其表面施加镀层。
In order to improve the corrosion resistance of A356 alloy,electroless Ni-P coatings were plated on the A356 alloy with and without a Ni pre-electroplating and then their corrsion performance was investigated by potentiodynamic polarization,salt spary test,SEM and microhardness.
用直接化学镀Ni-P和先电镀Ni后化学镀Ni-P两种方法在A356合金表面施加镀层。
Electroless Ni-P has been widely used in the microelectronic packing in the recent years because of the better solderability and diffusion barrier.
化学镀Ni-P是一种优异的钎焊阻挡层材料,具有良好的可焊性,近年来在微电子封装工业中得到了广泛的应用。
The surface of eccentric wheel was plated using electroless Ni–P plating and the process flow and formulation were presented.
采用化学镀Ni–P工艺对其表面进行镀覆处理,给出了工艺流程和规范,讨论了前处理工艺、零件装载量及搅拌频率、镀层中P含量对镀层性能的影响,确定了最佳工艺条件:(6±0。
The Research of Electroless Ni-P and Ni-W-P on AZ91D Magnesium Alloy;
AZ91D镁合金化学镀Ni-P及Ni-W-P的研究
The Research of Electroless Ni-P and Ni-P-SiC on AZ91D Magnesium Alloy
AZ91D镁合金化学镀Ni-P及Ni-P-SiC的研究
The Study of Electroless Ni-P/Ni-W-P Duplex Coatings on AZ91D Magnesium Alloy;
AZ91D镁合金化学镀Ni-P/Ni-W-P复合镀层的研究
Electroless Ni-P/Ni-W-P coatings on AZ91D magnesium alloy
AZ91D镁合金化学镀Ni-P/Ni-W-P双层镀层研究
Electroless Ni-P/Ni-B Coatings on AZ91D Magnesium;
AZ91D镁合金化学镀Ni-P/Ni-B
Recent Progress in Electroless Ni-P-SiC Composite Plating
化学镀Ni-P-SiC复合镀层的研究进展
Preparation and characterization of electroless Ni-P-MoS_2 composite coatings
化学镀Ni-P-MoS_2复合镀层的制备与表征
Study on the Process of Electroless Ni-P Alloy Plating and Ni-P-Carbon Fiber Composite Plating on Spin-rings;
纺织钢领化学镀Ni-P及Ni-P-碳纤维复合镀工艺研究
Study on the Frictional and Wear Properties of Electroless Ni-P Coating and Ni-P/PTFE Composite Coating;
化学镀Ni-P合金及Ni-P/PTFE复合镀层摩擦磨损性能的研究
Process optimization of electroless Ni-P plating on magnesium alloy
镁合金化学镀Ni-P工艺的优化设计
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
Technological Study on Ni-P Alloy Electroless Plating on Magnesium Alloys
镁合金化学镀Ni-P合金工艺研究
Electroless Composite Plating Ni-P/Ni-P-PTFE Double Coating
化学复合镀Ni-P/Ni-P-PTFE双镀层
Plating Technology and Properties of Electroless Ni-Mo-P Alloy Coatings
化学镀Ni-Mo-P合金镀工艺及镀层性能
Study of the Craft of Electroless Ni-P-Carbide Composite Plating;
Ni-P-碳化物化学复合镀工艺研究
Optimization of the Process of Electroless Ni-P-PTFE Composite Plating Based on Orthogonal Test
Ni-P-PTFE化学复合镀工艺的正交优化
The Study of Electroless Ni-W-P Alloy by Double-complexants Method;
双络合剂法化学镀Ni-W-P合金的研究
The Producing Process of Micro-component by Electroless Plating Ni-P;
化学铸（镀）制备Ni-P合金微构件的研究